• Dr. P. M. Raj is an Associate Professor with BME and ECE at FIU. His expertise is in the areas of packaging of electronic and bioelectronic systems, power-supply component integration, RF/5G components, integrated RF and power modules and fine-pitch interconnections. He was an adjunct faculty (2018-2021) with the Georgia Institute of Technology, ECE Department and Packaging Research Center. He co-lead several technical thrusts in electronic packaging, working with the whole electronic manufacturing ecosystem, which includes semiconductor, packaging, material, tool and end-user companies. He is widely recognized for his contributions in integrated passive components and technology road mapping, and also for promoting the role of nanomaterials and nanostructures for electronics packaging applications, as evident through his several industry partnerships, invited presentations, publications and awards.

    His research led to ~380 publications, which include ~110 journal papers, 19 book chapters and 16 articles in widely circulated trade magazines, and more than 225 conference publications in flagship IEEE conference. He received 13 patents with several other provisional patents and invention disclosures. His papers received more than 25 best-paper awards. He has been a research faculty at GT-PRC for 19 years, where he mentored more than 25 MS and PhD students, many of whom are current leaders in the electronics industry, working for global companies such as Apple Inc., Intel Corp, IBM, Texas Instruments, Broadcom Inc., Qualcomm Inc., and others.

    He was IEEE Nanotechnology Distinguished Lecturer (2020-2022) in Nanopackaging. He is the Associate Editor for IEEE CPMT transactions (Best Associate Editor, 2020) and IEEE Nanotechnology magazine, where he created multiple focused editions in Nanopackaging. He is the Co-Chair for the IEEE nanopackaging technical committee. He was the General Chair for 3D Power Electronics Manufacturing Conference, hosted by FIU in 2023. He has been instrumental in forming the “Nanopackaging” technical sessions at the IEEE NANOTECHNOLOGY conference. He chaired power and RF component and module sessions at the IEEE Electronic Component and Technology Conference (ECTC). He also co-chaired high-temperature packaging sessions at the IEEE/SEMI/iNEMI Future Car Electronics workshop. He has been actively involved with the PSMA (power sources manufacturers Association) and takes pro-active role in shaping up power electronics sessions at APEC and PEIM conferences. He is also in the steering committee of IEEE EPS IoT Committee. He was reviewer for about 100 journal papers. Dr. Raj is also a STEM ambassador and frequently offers nanoscience and nanotechnology demonstrations at local schools and at Georgia Tech for K-12 field trips.

research interests

  • Advanced embedded packaging for bioelectronics and electronics, power and data telemetry, hermetic packaging, feedthroughs

    Power components and package integration, nanocomponents and nanopackaging

    5G mobile communication,MIMO communication,array signal processing, interconnects with precision and impedance matching, integrated circuit interconnections, microwave antenna arrays, minimisation, next generation networks, system-in-package

selected scholarly works & creative activities

principal investigator on

full name

  • Markondeyaraj Pulugurtha


publication subject areas

Citation index-derived subject areas the researcher has published in