Reliability assessment off high density multi-layer board assembly using shadow Moire and luminescence spectroscopy Conference

Bansal, S, Raj, PM, Shinotani, K et al. (2002). Reliability assessment off high density multi-layer board assembly using shadow Moire and luminescence spectroscopy . 126-132.

cited authors

  • Bansal, S; Raj, PM; Shinotani, K; Bhattacharya, S; Tummala, R; Lance, MJ

authors

date/time interval

  • December 10, 2002 -

publication date

  • January 1, 2002

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Optics
  • Physical Sciences
  • Physics
  • Physics, Condensed Matter
  • Science & Technology
  • Technology
  • Thermodynamics

Location

  • SINGAPORE, SINGAPORE

International Standard Book Number (ISBN) 10

Conference

  • 4th Electronics Packaging Technology Conference (EPTC 2002)

publisher

  • IEEE

start page

  • 126

end page

  • 132