Low Cost, High Performance, and High Reliability 2.5D Silicon Interposer Conference

Sundaram, Venky, Chen, Qiao, Wang, Tao et al. (2013). Low Cost, High Performance, and High Reliability 2.5D Silicon Interposer . 342-347.

Industry Collaboration International Collaboration

cited authors

  • Sundaram, Venky; Chen, Qiao; Wang, Tao; Lu, Hao; Suzuki, Yuya; Smet, Vanessa; Kobayashi, Makoto; Pulugurtha, Raj; Tummala, Rao

authors

date/time interval

  • May 28, 2013 -

publication date

  • January 1, 2013

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Science & Technology
  • Technology

Location

  • NV, Las Vegas

Conference

  • IEEE 63rd Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE

start page

  • 342

end page

  • 347