Fabrication and Integration of Ultrathin, High-Density, High-Frequency Ta Capacitors on Silicon for Power Modules Conference

Chakraborti, Parthasarathi, Neuhart, Nathan, Sharma, Himani et al. (2016). Fabrication and Integration of Ultrathin, High-Density, High-Frequency Ta Capacitors on Silicon for Power Modules . 1958-1963. 10.1109/ECTC.2016.270

Industry Collaboration International Collaboration

cited authors

  • Chakraborti, Parthasarathi; Neuhart, Nathan; Sharma, Himani; Raj, PM; Tummala, Rao R; Rataj, Kamil-Paul; Schnitter, Christoph; Gandhi, Saumya; Stepniak, Frank; Romig, Matt; Lollis, Naomi

authors

date/time interval

  • May 31, 2016 -

publication date

  • January 1, 2016

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Science & Technology
  • Technology
  • capacitance density
  • integration
  • power modules
  • silicon

Location

  • NV, Las Vegas

Digital Object Identifier (DOI)

Conference

  • 66th IEEE Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE COMPUTER SOC

start page

  • 1958

end page

  • 1963