Thermomechanical Reliability of Nickel Pillar Interconnections Replacing Flip-Chip Solder Without Underfill Article

Aggarwal, Ankur O, Raj, P Markondeya, Lee, Baik-Woo et al. (2008). Thermomechanical Reliability of Nickel Pillar Interconnections Replacing Flip-Chip Solder Without Underfill . IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 31(4), 341-354. 10.1109/TEPM.2008.2001974

cited authors

  • Aggarwal, Ankur O; Raj, P Markondeya; Lee, Baik-Woo; Yim, Myung Jin; Iyer, Mahadevan; Wong, CP; Tummala, Rao R

authors

publication date

  • October 1, 2008

published in

keywords

  • Anisotropic conductive film (ACF)
  • Engineering
  • Engineering, Manufacturing
  • Science & Technology
  • Technology
  • failure analysis
  • fine-pitch interconnects
  • nano-structured interconnect
  • solder
  • thermomechanical reliability

Digital Object Identifier (DOI)

publisher

  • IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

start page

  • 341

end page

  • 354

volume

  • 31

issue

  • 4