IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING

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IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING Journal

publication venue for

Thermomechanical reliability of nickel pillar interconnections replacing flip-chip solder without underfill. 31:341-354. 2008
Colloidal processing of polymer ceramic nanocomposite integral capacitors. 26:100-105. 2003

International Standard Serial Number (ISSN)

1521-334X

journal abbreviation

IEEE T ELECTRON PACK