IEEE Transactions on Electronics Packaging Manufacturing

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IEEE Transactions on Electronics Packaging Manufacturing Journal

publication venue for

Thermomechanical Reliability of Nickel Pillar Interconnections Replacing Flip-Chip Solder Without Underfill. 31:341-354. 2008
Colloidal processing of polymer ceramic nanocomposite integral capacitors. 26:100-105. 2003

International Standard Serial Number (ISSN)

1521-334X