Remateable and Deformable Area-Array Interconnects in 3D Smart Wireless Sensor Packages Conference

Camara, Jose F Solis, Soroushiani, Sepehr, Wilding, Daniel et al. (2020). Remateable and Deformable Area-Array Interconnects in 3D Smart Wireless Sensor Packages . 671-676. 10.1109/ECTC32862.2020.00111

cited authors

  • Camara, Jose F Solis; Soroushiani, Sepehr; Wilding, Daniel; Sayeed, Sk Yeahia Been; Monshi, MM; Volakis, John L; Bhardwaj, Shubhendu; Raj, PM

date/time interval

  • June 3, 2020 -

publication date

  • January 1, 2020

keywords

  • 3D package
  • Engineering
  • Engineering, Electrical & Electronic
  • Remateable
  • Science & Technology
  • Technology
  • area-array
  • deformable
  • flexible
  • interconnects

Location

  • ELECTR NETWORK

Digital Object Identifier (DOI)

Conference

  • 70th IEEE Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE COMPUTER SOC

start page

  • 671

end page

  • 676