System-on-a-package (SOP) substrate and module with digital, RF and optical integration Conference

Sundaram, V, Tummala, R, White, G et al. (2004). System-on-a-package (SOP) substrate and module with digital, RF and optical integration . 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 17-23. 10.1109/ECTC.2004.1319309

cited authors

  • Sundaram, V; Tummala, R; White, G; Lim, K; Wan, LX; Guidotti, D; Liu, FH; Bhattacharya, S; Pulugurtha, RM; Abothu, IR; Doraiswami, R; Pucha, RV; Laskar, J; Tentzeris, M; Chang, GK; Swaminathan, M

authors

date/time interval

  • February 3, 2004 -

publication date

  • January 1, 2004

published in

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Science & Technology
  • Technology

Location

  • NV, Las Vegas

Digital Object Identifier (DOI)

International Standard Book Number (ISBN) 10

Conference

  • 54th Electronic Components and Technology Conference

publisher

  • IEEE

start page

  • 17

end page

  • 23