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Proceedings - Electronic Components and Technology Conference
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Overview
publication venue for
Additively-Deposited Fan-Out Interconnects for Power/RF Co-Packaging with Glass-Laminate Hybrid Panels
2026
Novel wireless PVDF-PEDOT:PSS/LIG based wearable multimodal sensing platform
2025
Reconfigurable Antennas and FSS with Magnetically-Tunable Multiferroic Components
2022
Self-healing of Interconnect Cracks for Reliable and Defect-Free Smart Manufacturing of Flexible Packages
2022
Chipscale Piezo-Magnetostrictive Interfaces - A new simplified and microminiaturized telemetry paradigm for Medical Device Packages
2021
Wireless Photonic Sensors with Flex Fan-Out Packaged Devices and Enhanced Power Telemetry
2021
3D Heterogeneous and Flexible Package Integration for Zero-Power Wireless Neural Recording
2020
Glass-Based IC-Embedded Antenna-Integrated Packages for 28-GHz High-Speed Data Communications
2020
Heterogeneous Integration of 5G and Millimeter-Wave Diplexers with 3D Glass Substrates
2020
High-Density Embedded Electronics in Textiles with 3D Flex Package Transfer
2020
Remateable and Deformable Area-Array Interconnects in 3D Smart Wireless Sensor Packages
2020
3D Glass Package-Integrated, High-Performance Power Dividing Networks for 5G Broadband Antennas
2019
3D Packaging with Embedded High-Power-Density Passives for Integrated Voltage Regulators
2019
Evaluation Of Fine-Pitch Routing Capabilities Of Advanced Dielectric Materials For High Speed Panel-RDL In 2.5D Interposer And Fan-Out Packages
2019
Low-Loss Additively-Deposited Ultra-Short Copper-Paste Interconnections in 3D Antenna-Integrated Packages for 5G and IoT Applications
2019
Demonstration of Hermetic Sealing on Ultra-Thin, Wafer-Integrated Aluminum-Polymer Capacitors for High-Voltage and High-Temperature Applications
2018
Demonstration of patternable all-Cu compliant interconnections with enhanced manufacturability in chip-to-substrate applications
2018
Glass in electronic packaging and integration: High Q inductances for 2.35 GHz impedance matching in 0.05 mm thin glass substrates
2018
High-Temperature And Moisture-Ageing Reliability of High-Density Power Packages For Electric Vehicles
2018
Integrated Copper Heat Spreaders in Glass Panel Embedded Packages with Near-Zero Thermal Interface Resistance
2018
Leading-Edge and Ultra-Thin 3D Glass-Polymer 5G Modules with Seamless Antenna-to-Transceiver Signal Transmissions
2018
Miniaturized High-Performance Filters for 5G Small-Cell Applications
2018
Novel 3D-/Inkjet-Printed Flexible On-Package Antennas, Packaging Structures, and Modules for Broadband 5G Applications
2018
Analysis Of System-Level Reliability Of Single-Chip Glass BGA Packages With Advanced Solders And Polymer Collars
2017
Design of Low-Profile Integrated Transformer and Inductor for Substrate-Embedding in 1-5kW Isolated GaN DC-DC Converters
2017
Enabling chip-to-substrate all-Cu interconnections: design of engineered bonding interfaces for improved manufacturability and low-temperature bonding
2017
First Demonstration of 28 GHz and 39 GHz Transmission Lines and Antennas on Glass Substrates for 5G Modules
2017
High Frequency Electrical Performance and Thermo-Mechanical Reliability of Fine-Pitch, Copper - Metallized Through-Package-Vias (TPVs) in Ultra - thin Glass Interposers
2017
High-Voltage Capacitors for Next-Generation Power Modules in Electric Vehicles
2017
Infusing inorganics into the subsurface of polymer redistribution layer dielectrics for improved adhesion to metal interconnects
2017
Integrated Copper Heat Slugs and EMI Shields in Panel Laminate (LFO) and Glass Fanout (GFO) Packages for High Power RF ICs
2017
Interfacial Delamanination of Mold Compound in Fan-out Packages
2017
Scaling Cu pillars to 20um pitch and below: critical role of surface finish and barrier layers
2017
Board-Level Reliability of 3D Through Glass Via Filters During Thermal Cycling
2016
Demonstration of Next-generation Au-Pd Surface Finish with Solder-capped Cu Pillars for Ultra-fine Pitch Applications
2016
Demonstration of enhanced system-level reliability of ultra-thin BGA packages with circumferential polymer collars and doped solder alloys
2016
Design and Demonstration of Ultra-thin Glass 3D IPD Diplexers
2016
Fabrication and Integration of Ultrathin, High-Density, High-Frequency Ta Capacitors on Silicon for Power Modules
2016
Highly-effective Integrated EMI Shields with Graphene and Nanomagnetic Multilayered Composites
2016
Innovative Electrical Thermal Co-design of Ultra-high Q TPV-based 3D Inductors in Glass Packages
2016
Magnetic materials and design trade-offs for high inductance density, high-Q and low-cost power and EMI filter inductors
2016
Modeling, Design, Fabrication and Demonstration of RF Front-End 3D IPAC Module with Ultra-thin Glass Substrates for LTE Applications
2016
Novel high-temperature, high-power handling all-Cu interconnections through low temperature sintering of nanocopper foams
2016
Reliability of Copper-Plated Through-Package-Via (TPV) in Glass Packages with in-situ stress measurements using Raman spectroscopy
2016
Thermocompression Bonding Process Design and Optimization for Warpage Mitigation of Ultra-thin Low-CTE Package Assemblies
2016
Ultra-thin Wireless Power Module with Integration of Wireless Inductive Link and Supercapacitors
2016
"Zero-Undercut" Semi-Additive Copper Patterning - A Breakthrough for Ultrafine-line RDL Lithographic Structures and Precision RF Thinfilm Passives
2015
Demonstration of Ultra-thin Tantalum Capacitors on Silicon Substrates for High-frequency and High-efficiency Power Applications
2015
First Demonstration of Copper-plated Through-Package-Via (TPV) Reliability in Ultra-thin 3D Glass Interposers with Double-side Component Assembly
2015
First Demonstration of Drop-test Reliability of Ultra-thin Glass BGA Packages Directly Assembled on Boards for Smartphone Applications
2015
Interconnection Materials, Processes and Tools for Fine-pitch Panel Assembly of Ultra-thin Glass Substrates
2015
Modeling, Design and Demonstration of Integrated Electromagnetic Shielding for Miniaturized RF SOP Glass Packages
2015
Modeling, Design and Demonstration of Low-temperature, Low-pressure and High-throughput Thermocompression Bonding of Copper Interconnections without Solders
2015
Modeling, Design and Demonstration of Ultra-miniaturized Glass PA Modules with Efficient Thermal Dissipation
2015
Modeling, Design and Demonstration of Ultra-short and Ultra-fine Pitch Metastable Cu-Sn Interconnections with High-throughput SLID Assembly
2015
Nanomagnetic Structures for Inductive Coupling and Shielding in Wireless Charging Applications
2015
Synthesis of Magneto-Dielectrics from First Principles and Antenna Design
2015
Ultra-thin and Ultra-small 3D Double-side Glass Power Modules with Advanced Inductors and Capacitors
2015
A New Era in Manufacturable, Low-Temperature and Ultra-Fine Pitch Cu Interconnections and Assembly Without Solders
2014
Accelerated SLID Bonding Using Thin Multi-layer Copper-Solder Stack for Fine-pitch Interconnections
2014
Adhesion and Reliability of Direct Cu Metallization of Through-Package Vias in Glass Interposers
2014
Coaxial Through-Package-Vias (TPVs) for Enhancing Power Integrity in 3D Double-side Glass Interposers
2014
Design and Demonstration of Paper-Thin and Low-Warpage Single and 3D Organic Packages with Chip-Last Embedding Technology for Smart Mobile Applications
2014
Large Low-CTE Glass Package-to-PCB Interconnections with Solder Strain-Relief Using Polymer Collars
2014
Magneto-dielectric Characterization and Antenna Design
2014
Modeling, Design and Demonstration of Multi-Die Embedded WLAN RF Front-End Module with Ultra-miniaturized and High-performance Passives
2014
Modeling, Design, and Demonstration of Low-temperature Cu Interconnections to Ultra-thin Glass Interposers at 20 μm Pitch
2014
Nanowires-based High-density Capacitors and Thinfilm Power Sources in Ultrathin 3D Glass Modules
2014
Novel Highly-Efficient and Misalignment Insensitive Wireless Power Transfer Systems Utilizing Strongly Coupled Magnetic Resonance Principles
2014
Co-W as an Advanced Barrier for Intermetallics and Electromigration in Fine-Pitch Flipchip Interconnections
2011
Conformal Atomic Layer Deposition (ALD) of Alumina on High Surface-Area Porous Copper Electrodes to Achieve Ultra-High Capacitance Density on Silicon Interposers
2011
High Throughput and Fine Pitch Cu-Cu Interconnection Technology for Multichip Chip-Last Embedding
2011
Novel Nanomagnetic Materials for High-Frequency RF Applications
2011
Solution-Derived Electrodes and Dielectrics for Low-Cost and High-Capacitance Trench and Through-Silicon-Via (TSV) Capacitors
2011
Co-Electrodeposited Graphite and Diamond-Loaded Solder Nanocomposites as Thermal Interface Materials
2010
Low Temperature, Low Profile, Ultra-Fine Pitch Copper-To-Copper Chip-Last Embedded-Active Interconnection Technology
2010
Low Temperature (<100°C) Deposited Pyrochlore Films with High Capacitance (200 nF/cm2), Low Loss (0.003) and Low TCF (<100 ppm/C) for Integrating RF Components
2008
Low-temperature, fine-pitch interconnections using self-patternable metallic nanoparticles as the bonding layer
2008
Microwave design & characterization of a novel Nano-Cu based ultra-fine pitch chip-to-package interconnect
2008
Real-time protein detection using ZnO nanowire/thin film bio-sensor integrated with microfluidic system
2008
Electrochemical biosensors and microfluidics in organic system-on-package technology
2007
Label-free protein detection by ZnO nanowire based bio-sensors
2007
Organic-based RF capacitors with ceramic-like properties
2007
Processing, properties and electrical reliability of embedded ultra-thin film ceramic capacitors in organic packages
2007
Reliability of nano-structured nickel interconnections replacing flipchip solder assembly without underfill
2007
Copper interconnections for high performance and fine pitch flipchip digital applications and ultra-miniaturized RF module applications
2006
Recent advances in low CTE and high density system-on-a-package (SOP) substrate with thin film component integration
2006
Tailoring the temperature coefficient of capacitance (TCC), dielectric loss and capacitance density with ceramic-polymer nanocomposites for RF applications
2006
50 micron pitch wafer level packaging testbed with reworkable IC-package nano interconnects
2005
Design of high power microwave miniaturized terminations
2005
Embedded decoupling capacitor performance in high speed circuits
2005
Exploring the limits of low cost, organics-compatible high-k ceramic thin-films for embedded decoupling applications
2005
Packaging of multi-core microprocessors: Trade-offs and potential solutions
2005
Recent advances in composite substrate materials for high-density and high reliability packaging applications
2005
Development of high-
k
embedded capacitors on printed wiring board using sol-gel and foil-transfer processes
2004
MEMS composite structures for tunable capacitors and IC-package nano interconnects
2004
New paradigm in IC-package interconnection by reworkable nano-interconnects
2004
Next generation of package/board materials technology for ultra-high density wiring and fine-pitch reliable interconnection assembly
2004
Piezoresistive MEMS pressure sensor and packaging for harsh oceanic environment
2004
Simultaneous switching noise suppression using hydrothermal barium titanate thin film capacitors
2004
System-on-a-package (SOP) substrate and module with digital, RF and optical integration
2004
Evaluation of low stress dielectrics for board application
2003
In-situ stress and warpage measurements to investigate reliability of flip-chip on board assembly without underfill
2003
Integration and high-frequency characterization of PWB-compatible pure barium titanate films synthesized by modified hydrothermal techniques (< 100° C)
2003
Evaluation of liquid crystal polymers for high performance SOP application
2002
Novel hydrothermal processing (<100° C) of ceramic-polymer composites for integral capacitor applications
2002
Processing of polymer-ceramic nanocomposites for system-on-package applications
2001
Delamination issues in integration of highly filled polymer-ceramic nanocomposite films on MCM-L compatible substrates
2000
IMPACT OF HIGH-T//C SUPERCONDUCTIVITY ON SYSTEM COMMUNICATIONS.
1988
Selection and evaluation of materials for future System-on-Package (SOP) substrate
2001
Identifiers
International Standard Serial Number (ISSN)
0569-5503
