Low-Loss Impedance-Matched Sub-25-μm Vias in 3-D Millimeter-Wave Packages Article

Watanabe, Atom O, Ito, Hirokazu, Markondeya, Raj Pulugurtha et al. (2020). Low-Loss Impedance-Matched Sub-25-μm Vias in 3-D Millimeter-Wave Packages . IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 10(5), 870-877. 10.1109/TCPMT.2020.2982294

Industry Collaboration International Collaboration

cited authors

  • Watanabe, Atom O; Ito, Hirokazu; Markondeya, Raj Pulugurtha; Tummala, Rao R; Swaminathan, Madhavan

authors

publication date

  • May 1, 2020

published in

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Engineering, Manufacturing
  • Fifth generation (5G)
  • GLASS
  • LASER
  • MICROVIAS
  • Materials Science
  • Materials Science, Multidisciplinary
  • Science & Technology
  • Technology
  • microvia
  • millimeter wave
  • packaging
  • signal loss

Digital Object Identifier (DOI)

publisher

  • IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

start page

  • 870

end page

  • 877

volume

  • 10

issue

  • 5