Low-Loss Impedance-Matched Sub-25-mu m Vias in 3-D Millimeter-Wave Packages
Article
Watanabe, Atom O, Ito, Hirokazu, Markondeya, Raj Pulugurtha et al. (2020). Low-Loss Impedance-Matched Sub-25-mu m Vias in 3-D Millimeter-Wave Packages
. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 10(5), 870-877. 10.1109/TCPMT.2020.2982294
Watanabe, Atom O, Ito, Hirokazu, Markondeya, Raj Pulugurtha et al. (2020). Low-Loss Impedance-Matched Sub-25-mu m Vias in 3-D Millimeter-Wave Packages
. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 10(5), 870-877. 10.1109/TCPMT.2020.2982294