IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY

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IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY Journal

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Prefabricated and Assembled Electromagnetic Shields Inside Electronic Packages to Reduce Near-Field Capacitive and Inductive Coupling. 14:1015-1024. 2024
Wireless Fully Passive Package-Embedded Seismocardiogram With RF Backscattering. 13:1516-1519. 2023
Miniaturized Fully Passive Wireless Neural Recording With Heterogeneous Integration in Thin Packages. 13:365-373. 2023
Package-Integrated, Wideband Power Dividing Networks and Antenna Arrays for 28-GHz 5G New Radio Bands. 10:1515-1523. 2020
Reliability of Fine-Pitch <5-μm-Diameter Microvias for High-Density Interconnects. 10:1552-1559. 2020
Low-Loss Impedance-Matched Sub-25-mu m Vias in 3-D Millimeter-Wave Packages. 10:870-877. 2020
Ultralow-Loss Substrate-Integrated Waveguides in Glass-Based Substrates for Millimeter-Wave Applications. 10:531-533. 2020
Substrate-Embedded Low-Resistance Solenoid Inductors for Integrated Voltage Regulators. 10:134-141. 2020
3-D Packaging and Integration of High-Density Tantalum Capacitors on Silicon. 9:1466-1472. 2019
Ultrathin High-Q 2-D and 3-D RF Inductors in Glass Packages. 8:643-652. 2018
Glass-Interposer Electromagnetic Bandgap Structure with Defected Ground Plane for Broadband Suppression of Power/Ground Noise Coupling. 7:1493-1505. 2017
Miniaturized Bandpass Filters as Ultrathin 3-D IPDs and Embedded Thinfilms in 3-D Glass Modules. 7:1410-1418. 2017
Reliability of copper through-package vias in bare glass interposers. 7:829-837. 2017
Board-Level Thermal Cycling and Drop-Test Reliability of Large, Ultrathin Glass BGA Packages for Smart Mobile Applications. 7:726-733. 2017
Ultrathin, substrate-integrated, and self-healing nanocapacitors with low-leakage currents and high-operating frequencies. 6:1776-1784. 2016
High-k Thin-Film Capacitors With Conducting Oxide Electrodes on Glass Substrates for Power-Supply Applications. 6:1561-1566. 2016
RF characterization of magnetodielectric material using cavity perturbation technique. 5:1850-1859. 2015
Direct SMT Interconnections of Large Low-CTE Interposers to Printed Wiring Board Using Copper Microwire Arrays. 5:1709-1719. 2015
Finite element analysis and experiment validation of highly reliable silicon and glass interposers-to-printed wiring board sMT interconnections. 4:796-806. 2014
All-solution thin-film capacitors and their deposition in trench and through-via structures. 3:688-695. 2013
Coelectrodeposited solder composite films for advanced thermal interface materials. 3:989-996. 2013
Multichip embedding technology using fine-pitch Cu-Cu interconnections. 3:197-204. 2013
Highly reliable and manufacturable ultrafine pitch Cu-Cu interconnections for chip-last embedding with chip-first benefits. 2:1434-1441. 2012
Foreword special section on nanopackaging 2016
Laminated Glass-Based, Compact Inline Stepped-Impedance Resonator Bandpass Filters for 5G New Radio Modules 2021
A Review of 5G Front-End Systems Package Integration 2021

category

ENGINEERING, ELECTRICAL & ELECTRONIC Category
ENGINEERING, MANUFACTURING Category
MATERIALS SCIENCE, MULTIDISCIPLINARY Category

International Standard Serial Number (ISSN)

2156-3950

Electronic International Standard Serial Number (EISSN)

2156-3985

journal abbreviation

IEEE T COMP PACK MAN