IEEE Transactions on Components, Packaging and Manufacturing Technology

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IEEE Transactions on Components, Packaging and Manufacturing Technology Journal

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Characterization of Emerging Polymer Dielectric Materials for Advanced Packaging Applications. 15:131-139. 2025
Prefabricated and Assembled Electromagnetic Shields Inside Electronic Packages to Reduce Near-Field Capacitive and Inductive Coupling. 14:1015-1024. 2024
Wireless Fully Passive Package-Embedded Seismocardiogram With RF Backscattering. 13:1516-1519. 2023
Miniaturized Fully Passive Wireless Neural Recording With Heterogeneous Integration in Thin Packages. 13:365-373. 2023
Package-Integrated, Wideband Power Dividing Networks and Antenna Arrays for 28-GHz 5G New Radio Bands. 10:1515-1523. 2020
Reliability of Fine-Pitch <5-μm-Diameter Microvias for High-Density Interconnects. 10:1552-1559. 2020
Low-Loss Impedance-Matched Sub-25-μm Vias in 3-D Millimeter-Wave Packages. 10:870-877. 2020
Ultralow-Loss Substrate-Integrated Waveguides in Glass-Based Substrates for Millimeter-Wave Applications. 10:531-533. 2020
Substrate-Embedded Low-Resistance Solenoid Inductors for Integrated Voltage Regulators. 10:134-141. 2020
3-D Packaging and Integration of High-Density Tantalum Capacitors on Silicon. 9:1466-1472. 2019
Ultrathin High-Q 2-D and 3-D RF Inductors in Glass Packages. 8:643-652. 2018
Glass-Interposer Electromagnetic Bandgap Structure With Defected Ground Plane for Broadband Suppression of Power/Ground Noise Coupling. 7:1493-1505. 2017
Miniaturized Bandpass Filters as Ultrathin 3-D IPDs and Embedded Thinfilms in 3-D Glass Modules. 7:1410-1418. 2017
Reliability of Copper Through-Package Vias in Bare Glass Interposers. 7:829-837. 2017
Board-Level Thermal Cycling and Drop-Test Reliability of Large, Ultrathin Glass BGA Packages for Smart Mobile Applications. 7:726-733. 2017
Ultrathin, Substrate-Integrated, and Self-Healing Nanocapacitors With Low-Leakage Currents and High-Operating Frequencies. 6:1776-1784. 2016
High-k Thin-Film Capacitors With Conducting Oxide Electrodes on Glass Substrates for Power-Supply Applications. 6:1561-1566. 2016
RF Characterization of Magnetodielectric Material Using Cavity Perturbation Technique. 5:1850-1859. 2015
Direct SMT Interconnections of Large Low-CTE Interposers to Printed Wiring Board Using Copper Microwire Arrays. 5:1709-1719. 2015
Finite Element Analysis and Experiment Validation of Highly Reliable Silicon and Glass Interposers-to-Printed Wiring Board SMT Interconnections. 4:796-806. 2014
Coelectrodeposited Solder Composite Films for Advanced Thermal Interface Materials. 3:989-996. 2013
All-Solution Thin-film Capacitors and Their Deposition in Trench and Through-Via Structures. 3:688-695. 2013
Multichip Embedding Technology Using Fine-Pitch Cu-Cu Interconnections. 3:197-204. 2013
Highly Reliable and Manufacturable Ultrafine Pitch Cu-Cu Interconnections for Chip-Last Embedding With Chip-First Benefits. 2:1434-1441. 2012
Laminated Glass-Based, Compact Inline Stepped-Impedance Resonator Bandpass Filters for 5G New Radio Modules 2021
A Review of 5G Front-End Systems Package Integration 2021
Special Section on Nanopackaging Foreword 2016

International Standard Serial Number (ISSN)

2156-3950

Electronic International Standard Serial Number (EISSN)

2156-3985