Direct SMT Interconnections of Large Low-CTE Interposers to Printed Wiring Board Using Copper Microwire Arrays Article

Qin, Xian, Raj, Pulugurtha Markondeya, Smet, Vanessa et al. (2015). Direct SMT Interconnections of Large Low-CTE Interposers to Printed Wiring Board Using Copper Microwire Arrays . IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 5(11), 1709-1719. 10.1109/TCPMT.2015.2482962

cited authors

  • Qin, Xian; Raj, Pulugurtha Markondeya; Smet, Vanessa; Tummala, Rao

authors

publication date

  • November 1, 2015

published in

keywords

  • BEHAVIOR
  • Connectors
  • Engineering
  • Engineering, Electrical & Electronic
  • Engineering, Manufacturing
  • Materials Science
  • Materials Science, Multidisciplinary
  • SOLDER JOINTS
  • Science & Technology
  • Technology
  • electronics packaging
  • surface-mount technology

Digital Object Identifier (DOI)

publisher

  • IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

start page

  • 1709

end page

  • 1719

volume

  • 5

issue

  • 11