Ultrathin High-Q 2-D and 3-D RF Inductors in Glass Packages Article

Kim, Min Suk, Pulugurtha, Markondeya Raj, Sundaram, Venky et al. (2018). Ultrathin High-Q 2-D and 3-D RF Inductors in Glass Packages . IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 8(4), 643-652. 10.1109/TCPMT.2018.2807416

Industry Collaboration

cited authors

  • Kim, Min Suk; Pulugurtha, Markondeya Raj; Sundaram, Venky; Tummala, Rao R; Yun, Hobie

authors

publication date

  • April 1, 2018

published in

keywords

  • 3-D inductors
  • EMBEDDED INDUCTORS
  • Engineering
  • Engineering, Electrical & Electronic
  • Engineering, Manufacturing
  • Glass package
  • INTERPOSERS
  • Materials Science
  • Materials Science, Multidisciplinary
  • PITCH
  • RF inductors
  • RF passives
  • SILICON
  • Science & Technology
  • Technology
  • VIAS
  • high-Q inductors
  • passive components
  • spiral inductors
  • thin-film inductors

Digital Object Identifier (DOI)

publisher

  • IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

start page

  • 643

end page

  • 652

volume

  • 8

issue

  • 4