Glass-Interposer Electromagnetic Bandgap Structure with Defected Ground Plane for Broadband Suppression of Power/Ground Noise Coupling
Article
Kim, Y, Cho, J, Cho, K et al. (2017). Glass-Interposer Electromagnetic Bandgap Structure with Defected Ground Plane for Broadband Suppression of Power/Ground Noise Coupling
. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 7(9), 1493-1505. 10.1109/TCPMT.2017.2730853
Kim, Y, Cho, J, Cho, K et al. (2017). Glass-Interposer Electromagnetic Bandgap Structure with Defected Ground Plane for Broadband Suppression of Power/Ground Noise Coupling
. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 7(9), 1493-1505. 10.1109/TCPMT.2017.2730853
In this paper, we propose glass-interposer (GI) electromagnetic bandgap (EBG) structure with defected ground plane (DGP) for efficient and broadband suppression of power/ground noise coupling. We designed, fabricated, measured, and analyzed a GI-EBG structure with DGP for the first time. The proposed GI-EBG structure with DGP is thoroughly analyzed using the dispersion characteristics and estimated stopband edges, fL and fU. We experimentally verified that the proposed GI-EBG structure with DGP achieved power/ground noise isolation bandgap (below-30 dB) between fL of 5.7 GHz and fU of 11 GHz. Estimation of fL and fU using dispersion analysis, full 3-D electromagnetic (EM) simulation results, and measurement results achieved good correlation. Effectiveness of the proposed GI-EBG structure with DGP on suppression of the power/ground noise coupling to high-speed through glass via (TGV) channel is verified with 3-D EM simulation. As a result, the proposed EBG structure successfully and efficiently suppressed the power/ground noise coupling and improved the eye diagram of the TGV channel. Lastly, we embedded thin alumina film in the proposed EBG structure and achieved even broader power/ground noise suppression between 2.1 and 14.7 GHz.
