Glass-Interposer Electromagnetic Bandgap Structure With Defected Ground Plane for Broadband Suppression of Power/Ground Noise Coupling Article

Kim, Youngwoo, Cho, Jonghyun, Cho, Kyungjun et al. (2017). Glass-Interposer Electromagnetic Bandgap Structure With Defected Ground Plane for Broadband Suppression of Power/Ground Noise Coupling . IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 7(9), 1493-1505. 10.1109/TCPMT.2017.2730853

International Collaboration

cited authors

  • Kim, Youngwoo; Cho, Jonghyun; Cho, Kyungjun; Park, Junyong; Kim, Subin; Kim, Dong-Hyun; Park, Gapyeol; Sitaraman, Srikrishna; Raj, Pulugurtha Markondeya; Tummala, Rao R; Kim, Joungho

authors

publication date

  • September 1, 2017

published in

keywords

  • CEM
  • DESIGN
  • Defected ground plane (DGP)
  • Engineering
  • Engineering, Electrical & Electronic
  • Engineering, Manufacturing
  • INTEGRATION
  • Materials Science
  • Materials Science, Multidisciplinary
  • SELECTIVE VALIDATION FSV
  • SIZE
  • Science & Technology
  • Technology
  • electromagnetic bandgap (EBG)
  • glass
  • interposer
  • power/ground noise
  • through glass via (TGV)

Digital Object Identifier (DOI)

publisher

  • IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

start page

  • 1493

end page

  • 1505

volume

  • 7

issue

  • 9