Reliability of Fine-Pitch <5-μm-Diameter Microvias for High-Density Interconnects Article

Dwarakanath, Shreya, Kakutani, Takenori, Okamoto, Daichi et al. (2020). Reliability of Fine-Pitch <5-μm-Diameter Microvias for High-Density Interconnects . IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 10(9), 1552-1559. 10.1109/TCPMT.2020.3013197

International Collaboration

cited authors

  • Dwarakanath, Shreya; Kakutani, Takenori; Okamoto, Daichi; Raj, Pulugurtha Markondeya; Swaminathan, Madhavan; Tummala, Rao R

authors

publication date

  • September 1, 2020

published in

keywords

  • Advanced packaging
  • Copper
  • Engineering
  • Engineering, Electrical & Electronic
  • Engineering, Manufacturing
  • Fatigue
  • Geometry
  • Material properties
  • Materials Science
  • Materials Science, Multidisciplinary
  • Polymers
  • Reliability
  • Science & Technology
  • Strain
  • THERMOMECHANICAL RELIABILITY
  • THROUGH-PACKAGE-VIAS
  • Technology
  • fan-out
  • heterogeneous integration
  • high-bandwidth computing
  • high-density
  • interconnects
  • interposer
  • microvia
  • reliability

Digital Object Identifier (DOI)

publisher

  • IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

start page

  • 1552

end page

  • 1559

volume

  • 10

issue

  • 9