Multichip Embedding Technology Using Fine-Pitch Cu-Cu Interconnections Article

Khan, Sadia A, Choudhury, Abhishek, Kumbhat, Nitesh et al. (2013). Multichip Embedding Technology Using Fine-Pitch Cu-Cu Interconnections . IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 3(2), 197-204. 10.1109/TCPMT.2012.2235528

Industry Collaboration International Collaboration

cited authors

  • Khan, Sadia A; Choudhury, Abhishek; Kumbhat, Nitesh; Pulugurtha, Markondeya Raj; Sundaram, Venky; Meyer-Berg, Georg; Tummala, Rao

authors

publication date

  • February 1, 2013

published in

keywords

  • CHIP
  • Copper
  • Engineering
  • Engineering, Electrical & Electronic
  • Engineering, Manufacturing
  • Materials Science
  • Materials Science, Multidisciplinary
  • Science & Technology
  • Technology
  • interconnections
  • packaging

Digital Object Identifier (DOI)

publisher

  • IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

start page

  • 197

end page

  • 204

volume

  • 3

issue

  • 2