3-D Packaging and Integration of High-Density Tantalum Capacitors on Silicon Article

Spurney, Robert Grant, Sharma, Himani, Raj, Pulugurtha Markondeya et al. (2019). 3-D Packaging and Integration of High-Density Tantalum Capacitors on Silicon . IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 9(8), 1466-1472. 10.1109/TCPMT.2019.2923698

Industry Collaboration International Collaboration

cited authors

  • Spurney, Robert Grant; Sharma, Himani; Raj, Pulugurtha Markondeya; Tummala, Rao; Lollis, Naomi; Weaver, Mitch; Romig, Matt; Gandhi, Saumya; Brumm, Holger

authors

publication date

  • August 1, 2019

published in

keywords

  • 3-D power
  • Engineering
  • Engineering, Electrical & Electronic
  • Engineering, Manufacturing
  • Materials Science
  • Materials Science, Multidisciplinary
  • SYSTEM
  • Science & Technology
  • Technology
  • capacitors
  • embedded passives

Digital Object Identifier (DOI)

publisher

  • IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

start page

  • 1466

end page

  • 1472

volume

  • 9

issue

  • 8