Highly Reliable and Manufacturable Ultrafine Pitch Cu-Cu Interconnections for Chip-Last Embedding With Chip-First Benefits Article

Kumbhat, Nitesh, Choudhury, Abhishek, Mehrotra, Gaurav et al. (2012). Highly Reliable and Manufacturable Ultrafine Pitch Cu-Cu Interconnections for Chip-Last Embedding With Chip-First Benefits . IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2(9), 1434-1441. 10.1109/TCPMT.2012.2192120

cited authors

  • Kumbhat, Nitesh; Choudhury, Abhishek; Mehrotra, Gaurav; Raj, Pulugurtha Markondeya; Sundaram, Venky; Tummala, Rao

authors

publication date

  • September 1, 2012

published in

keywords

  • Adhesive
  • CONDUCTIVE FILM ACF
  • Cu-Cu
  • Engineering
  • Engineering, Electrical & Electronic
  • Engineering, Manufacturing
  • FLIP-CHIP
  • Materials Science
  • Materials Science, Multidisciplinary
  • NCF
  • Science & Technology
  • Technology
  • fine pitch
  • flip-chip
  • packaging
  • reliability
  • thermo-compression

Digital Object Identifier (DOI)

publisher

  • IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

start page

  • 1434

end page

  • 1441

volume

  • 2

issue

  • 9