Characterization of Emerging Polymer Dielectric Materials for Advanced Packaging Applications Article

Dwarakanath, Shreya, Bhaskar, Pragna, Kanno, Kimiyuki et al. (2025). Characterization of Emerging Polymer Dielectric Materials for Advanced Packaging Applications . IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 15(1), 131-139. 10.1109/TCPMT.2024.3480090

cited authors

  • Dwarakanath, Shreya; Bhaskar, Pragna; Kanno, Kimiyuki; Nimbalkar, Pratik C; Kathaperumal, Mohanalingam; Raj Pulugurtha, Markondeya; Swaminathan, Madhavan; Tummala, Rao R

authors

publication date

  • January 1, 2025

published in

keywords

  • Bandwidth
  • Computer architecture
  • Dielectric constant
  • Dielectrics
  • Engineering
  • Engineering, Electrical & Electronic
  • Engineering, Manufacturing
  • High-bandwidth
  • Impedance
  • MECHANISM
  • Materials Science
  • Materials Science, Multidisciplinary
  • Microstrip
  • Moisture
  • Packaging
  • Polymers
  • Science & Technology
  • Technology
  • Wiring
  • moisture absorption
  • panel-scale
  • polymer dielectrics
  • surface planarity
  • ultra-thin
  • ultralow D-k
  • warpage

Digital Object Identifier (DOI)

publisher

  • IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

start page

  • 131

end page

  • 139

volume

  • 15

issue

  • 1