All-Solution Thin-film Capacitors and Their Deposition in Trench and Through-Via Structures Article

Wang, Yushu, Xiang, Shu, Pulugurtha, Markondeya Raj et al. (2013). All-Solution Thin-film Capacitors and Their Deposition in Trench and Through-Via Structures . IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 3(4), 688-695. 10.1109/TCPMT.2012.2227963

Industry Collaboration

cited authors

  • Wang, Yushu; Xiang, Shu; Pulugurtha, Markondeya Raj; Sharma, Himani; Williams, Byron; Tummala, Rao

sustainable development goals

authors

publication date

  • April 1, 2013

published in

keywords

  • CHEMICAL SOLUTION DEPOSITION
  • Capacitors
  • ELECTRODES
  • Engineering
  • Engineering, Electrical & Electronic
  • Engineering, Manufacturing
  • FATIGUE
  • ISSUES
  • Materials Science
  • Materials Science, Multidisciplinary
  • SILICON
  • Science & Technology
  • TEMPERATURE
  • Technology
  • decoupling
  • interposers
  • lead zirconate titanate (PZT)
  • sol-gel
  • through-vias

Digital Object Identifier (DOI)

publisher

  • IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

start page

  • 688

end page

  • 695

volume

  • 3

issue

  • 4