A Review of 5G Front-End Systems Package Integration Review

Watanabe, Atom O, Ali, Muhammad, Sayeed, Sk Yeahia Been et al. (2021). A Review of 5G Front-End Systems Package Integration . IEEE Transactions on Components, Packaging and Manufacturing Technology, 11(1), 118-133. 10.1109/TCPMT.2020.3041412

Open Access Industry Collaboration

cited authors

  • Watanabe, Atom O; Ali, Muhammad; Sayeed, Sk Yeahia Been; Tummala, Rao R; Pulugurtha, Markondeya Raj

authors

publication date

  • January 1, 2021

published in

keywords

  • 3GPP
  • 5G mobile communication
  • ANTENNA-IN-PACKAGE
  • ARRAY
  • Antenna arrays
  • Antenna-in-package (AiP)
  • Array signal processing
  • CHIP
  • Engineering
  • Engineering, Electrical & Electronic
  • Engineering, Manufacturing
  • Long Term Evolution
  • Materials Science
  • Materials Science, Multidisciplinary
  • Packaging
  • Science & Technology
  • Technology
  • Ultra reliable low latency communication
  • fifth generation (5G)
  • heterogeneous integration
  • millimeter wave (mm-wave)
  • packaging

Digital Object Identifier (DOI)

start page

  • 118

end page

  • 133

volume

  • 11

issue

  • 1