Board-Level Thermal Cycling and Drop-Test Reliability of Large, Ultrathin Glass BGA Packages for Smart Mobile Applications Article

Singh, Bhupender, Menezes, Gary, McCann, Scott et al. (2017). Board-Level Thermal Cycling and Drop-Test Reliability of Large, Ultrathin Glass BGA Packages for Smart Mobile Applications . IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 7(5), 726-733. 10.1109/TCPMT.2017.2684464

Industry Collaboration

cited authors

  • Singh, Bhupender; Menezes, Gary; McCann, Scott; Jayaram, Vidya; Ray, Urmi; Sundaram, Venky; Pulugurtha, Raj; Smet, Vanessa; Tummala, Rao

authors

publication date

  • May 1, 2017

published in

keywords

  • Drop testing
  • Engineering
  • Engineering, Electrical & Electronic
  • Engineering, Manufacturing
  • IMPACT RELIABILITY
  • Materials Science
  • Materials Science, Multidisciplinary
  • SOLDER JOINT
  • Science & Technology
  • Technology
  • glass package
  • thermal cycling

Digital Object Identifier (DOI)

publisher

  • IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

start page

  • 726

end page

  • 733

volume

  • 7

issue

  • 5