Prefabricated and Assembled Electromagnetic Shields Inside Electronic Packages to Reduce Near-Field Capacitive and Inductive Coupling Article

Al-Duhni, Ghaleb Saleh Ghaleb, Khasgiwala, Mudit, Volakis, John L et al. (2024). Prefabricated and Assembled Electromagnetic Shields Inside Electronic Packages to Reduce Near-Field Capacitive and Inductive Coupling . IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 14(6), 1015-1024. 10.1109/TCPMT.2024.3401617

International Collaboration

cited authors

  • Al-Duhni, Ghaleb Saleh Ghaleb; Khasgiwala, Mudit; Volakis, John L; Raj, Pulugurtha Markondeya

authors

publication date

  • June 1, 2024

published in

keywords

  • Compartmentalized shield
  • Couplings
  • EMI
  • Electromagnetic interference
  • Engineering
  • Engineering, Electrical & Electronic
  • Engineering, Manufacturing
  • Fabrication
  • Inductive coupling
  • Materials Science
  • Materials Science, Multidisciplinary
  • Metals
  • Noise
  • Science & Technology
  • Technology
  • Voltage
  • conformal shield
  • monolithic copper (Cu)
  • prefabricated and assembled electromagnetic interference (EMI) shielding
  • thin and thick EMI shielding

Digital Object Identifier (DOI)

publisher

  • IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

start page

  • 1015

end page

  • 1024

volume

  • 14

issue

  • 6