Finite Element Analysis and Experiment Validation of Highly Reliable Silicon and Glass Interposers-to-Printed Wiring Board SMT Interconnections Article

Qin, Xian, Kumbhat, Nitesh, Raj, Pulugurtha Markondeya et al. (2014). Finite Element Analysis and Experiment Validation of Highly Reliable Silicon and Glass Interposers-to-Printed Wiring Board SMT Interconnections . IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 4(5), 796-806. 10.1109/TCPMT.2013.2296780

cited authors

  • Qin, Xian; Kumbhat, Nitesh; Raj, Pulugurtha Markondeya; Sundaram, Venky; Tummala, Rao

authors

publication date

  • May 1, 2014

published in

keywords

  • Compliant dielectric
  • DESIGN
  • Engineering
  • Engineering, Electrical & Electronic
  • Engineering, Manufacturing
  • Materials Science
  • Materials Science, Multidisciplinary
  • SOLDER
  • Science & Technology
  • Technology
  • finite element method
  • model validation
  • reliability test
  • thin silicon or glass interposer

Digital Object Identifier (DOI)

publisher

  • IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

start page

  • 796

end page

  • 806

volume

  • 4

issue

  • 5