Coelectrodeposited Solder Composite Films for Advanced Thermal Interface Materials Article

Raj, Pulugurtha Markondeya, Gangidi, Prashant Reddy, Nataraj, Nikhilesh et al. (2013). Coelectrodeposited Solder Composite Films for Advanced Thermal Interface Materials . IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 3(6), 989-996. 10.1109/TCPMT.2013.2249583

Industry Collaboration

cited authors

  • Raj, Pulugurtha Markondeya; Gangidi, Prashant Reddy; Nataraj, Nikhilesh; Kumbhat, Nitesh; Jha, Gopal C; Tummala, Rao; Brese, Nathaniel

sustainable development goals

authors

publication date

  • June 1, 2013

published in

keywords

  • Analytical models
  • CONDUCTIVITY
  • DIAMOND
  • Engineering
  • Engineering, Electrical & Electronic
  • Engineering, Manufacturing
  • MICROSTRUCTURE
  • Materials Science
  • Materials Science, Multidisciplinary
  • Science & Technology
  • Technology
  • bonding processes
  • composite materials
  • dielectrophoresis
  • thermal management of electronics

Digital Object Identifier (DOI)

publisher

  • IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

start page

  • 989

end page

  • 996

volume

  • 3

issue

  • 6