Novel board material technology for next-generation packaging Conference

Kumbhat, N, Hegde, S, Raj, PM et al. (2004). Novel board material technology for next-generation packaging . 247-252. 10.1109/ISAPM.2004.1288021

cited authors

  • Kumbhat, N; Hegde, S; Raj, PM; Pucha, RV; Doraiswami, R; Hayes, S; Atmur, S; Bhattacharya, S; Sitaraman, SK; Tummala, RR

authors

date/time interval

  • March 24, 2004 -

publication date

  • January 1, 2004

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Materials Science
  • Materials Science, Multidisciplinary
  • Science & Technology
  • Technology

Location

  • GA, Atlanta

Digital Object Identifier (DOI)

International Standard Book Number (ISBN) 10

Conference

  • 9th International Symposium on Advanced Packaging Materials

publisher

  • IEEE

start page

  • 247

end page

  • 252