Mid frequency decoupling using embedded decoupling capacitors Conference

Muthana, P, Swaminathan, M, Engin, E et al. (2005). Mid frequency decoupling using embedded decoupling capacitors . 2005 271-274. 10.1109/EPEP.2005.1563756

cited authors

  • Muthana, P; Swaminathan, M; Engin, E; Markondeya Raj, P; Tummala, R

abstract

  • Surface Mount Technology (SMT) decoupling capacitors fail to provide decoupling above 100MHz. This paper presents the use of embedded thin film capacitors to provide decoupling in the mid frequency range from 100MHz to 2GHz. On-chip capacitance provides decoupling above 2GHz. The effect of chip, package and board capacitors on the performance of digital systems is analyzed taking into account the parasitic effects of power/ground planes, vias and solder balls. A synthesis and selection methodology for embedded package capacitors is also presented. ©2005 IEEE.

publication date

  • December 1, 2005

Digital Object Identifier (DOI)

International Standard Book Number (ISBN) 10

International Standard Book Number (ISBN) 13

start page

  • 271

end page

  • 274

volume

  • 2005