High-Density Embedded Electronics in Textiles with 3D Flex Package Transfer Conference

Monshi, Md Monirojjaman, Camara, Jose-Solis, Bhardwaj, Shubhendu et al. (2020). High-Density Embedded Electronics in Textiles with 3D Flex Package Transfer . 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 835-840. 10.1109/ECTC32862.2020.00136

cited authors

  • Monshi, Md Monirojjaman; Camara, Jose-Solis; Bhardwaj, Shubhendu; Volakis, John L; Raj, PM

authors

date/time interval

  • June 3, 2020 -

publication date

  • January 1, 2020

published in

keywords

  • 3D Flex Packaging
  • ANTENNAS
  • Adhesion
  • Engineering
  • Engineering, Electrical & Electronic
  • FABRICATION
  • Fluoroelastomer
  • High-Density Circuit
  • Moisture
  • Reliability
  • Science & Technology
  • Technology

Location

  • ELECTR NETWORK

Digital Object Identifier (DOI)

Conference

  • 70th IEEE Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE COMPUTER SOC

start page

  • 835

end page

  • 840