Low-Loss Additively-Deposited Ultra-Short Copper-Paste Interconnections in 3D Antenna-Integrated Packages for 5G and IoT Applications Conference

Watanabe, Atom O, Wang, Yiteng, Ogura, Nobuo et al. (2019). Low-Loss Additively-Deposited Ultra-Short Copper-Paste Interconnections in 3D Antenna-Integrated Packages for 5G and IoT Applications . 972-976. 10.1109/ECTC.2019.00152

Industry Collaboration International Collaboration

cited authors

  • Watanabe, Atom O; Wang, Yiteng; Ogura, Nobuo; Raj, P Markondeya; Smet, Vanessa; Tentzeris, Manos M; Tummala, Rao R

sustainable development goals

date/time interval

  • May 29, 2019 -

publication date

  • January 1, 2019

keywords

  • 5G communications
  • Antenna in package
  • Copperpaste
  • Engineering
  • Engineering, Electrical & Electronic
  • Interconnect bump
  • Low loss interconnect
  • Millimeter wave
  • Science & Technology
  • Technology

Location

  • Las Vegas, NV

Digital Object Identifier (DOI)

Conference

  • 69th IEEE Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE

start page

  • 972

end page

  • 976