Future of Packaging and packaging materials Conference

Tummala, Rao, Wong, CP, Qu, Jianmin et al. (2006). Future of Packaging and packaging materials . 57-57.

cited authors

  • Tummala, Rao; Wong, CP; Qu, Jianmin; Sitaraman, Suresh; Raj, P Markondeva

authors

date/time interval

  • March 15, 2006 -

publication date

  • January 1, 2006

keywords

  • Materials Science
  • Materials Science, Multidisciplinary
  • Science & Technology
  • Technology

Location

  • GA, Atlanta

International Standard Book Number (ISBN) 13

Conference

  • 11th International Symposium on Advanced Packaging Materials - Processes, Properties and Interface

publisher

  • IEEE

start page

  • 57

end page

  • 57