Interconnection Materials, Processes and Tools for Fine-pitch Panel Assembly of Ultra-thin Glass Substrates Conference

Smet, Vanessa, Huang, Ting-Chia, Kawamoto, Satomi et al. (2015). Interconnection Materials, Processes and Tools for Fine-pitch Panel Assembly of Ultra-thin Glass Substrates . 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 475-483.

International Collaboration

cited authors

  • Smet, Vanessa; Huang, Ting-Chia; Kawamoto, Satomi; Singh, Bhupender; Sundaram, Venky; Raj, Pulugurtha Markondeya; Tummala, Rao

authors

date/time interval

  • May 26, 2015 -

publication date

  • January 1, 2015

published in

keywords

  • Computer Science
  • Computer Science, Theory & Methods
  • Engineering
  • Engineering, Electrical & Electronic
  • Science & Technology
  • Technology

Location

  • CA, San Diego

Conference

  • IEEE 65th Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE

start page

  • 475

end page

  • 483