Demonstration of Hermetic Sealing on Ultra-Thin, Wafer-Integrated Aluminum-Polymer Capacitors for High-Voltage and High-Temperature Applications Conference

Spurney, Robert Grant, Sharma, Himani, Raj, PM et al. (2018). Demonstration of Hermetic Sealing on Ultra-Thin, Wafer-Integrated Aluminum-Polymer Capacitors for High-Voltage and High-Temperature Applications . 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 1414-1420. 10.1109/ECTC.2018.00216

Industry Collaboration

cited authors

  • Spurney, Robert Grant; Sharma, Himani; Raj, PM; Tummala, Rao; Lollis, Naomi; Weaver, Mitch; Gandhi, Saumya; Romig, Matt

authors

date/time interval

  • May 29, 2018 -

publication date

  • January 1, 2018

published in

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Science & Technology
  • Technology
  • embedded capacitors
  • high-temperature
  • panel-scale
  • passive component
  • reliability
  • wafer-level packaging

Location

  • CA, San Diego

Digital Object Identifier (DOI)

Conference

  • 68th IEEE Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE

start page

  • 1414

end page

  • 1420