Control of warpage during build-up of multilayered high-density wiring with stiff and low-CTE base substrates
Conference
Banerji, S, Raj, PM, Shinotani, K et al. (2001). Control of warpage during build-up of multilayered high-density wiring with stiff and low-CTE base substrates
. SMART BIOMEDICAL AND PHYSIOLOGICAL SENSOR TECHNOLOGY XI, 4428 279-284.
Banerji, S, Raj, PM, Shinotani, K et al. (2001). Control of warpage during build-up of multilayered high-density wiring with stiff and low-CTE base substrates
. SMART BIOMEDICAL AND PHYSIOLOGICAL SENSOR TECHNOLOGY XI, 4428 279-284.
This work discusses the warpage reduction using stiff substrates for System-On-Package applications and the validation of predictions using FEM analysis. New composite materials using advanced fibers and fillers were fabricated and tested to evaluate the increase in performance compared to conventional glass-epoxy (FR4) substrates. These composites have 2-3 times higher modulus than conventional FR4 and a lower CTE. Metal matrix composites (Al/C, Al/SiC, Al/Si) with low CTE 7-9 ppm/C and high modulus (100-250 GPa) were also evaluated. Warpage was characterized using a laser confocal microscope with a vertical resolution of <1 micron and a travelling stage that can be accurately positioned. Experimental curvature measurements are compared with the analytical and FEM estimates. Stresses are estimated in the solder and film for substrates with different CTE and modulus.
