Control of warpage during build-up of multilayered high-density wiring with stiff and low-CTE base substrates Conference

Banerji, S, Raj, PM, Shinotani, K et al. (2001). Control of warpage during build-up of multilayered high-density wiring with stiff and low-CTE base substrates . SMART BIOMEDICAL AND PHYSIOLOGICAL SENSOR TECHNOLOGY XI, 4428 279-284.

cited authors

  • Banerji, S; Raj, PM; Shinotani, K; Seo, M; Zweben, C; Bhattacharya, SK; Tummala, RR

authors

date/time interval

  • April 17, 2001 -

publication date

  • January 1, 2001

published in

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Engineering, Manufacturing
  • Science & Technology
  • Technology

Location

  • CA, SANTA CLARA

International Standard Book Number (ISBN) 10

Conference

  • International Conference on High-Density Interconnect and Systems Packaging (HD Int 2001)

publisher

  • SPIE-INT SOC OPTICAL ENGINEERING

start page

  • 279

end page

  • 284

volume

  • 4428