Recent advances in composite substrate materials for high-density and high reliability packaging applications Conference

Kumbhat, N, Raj, PM, Pucha, RV et al. (2005). Recent advances in composite substrate materials for high-density and high reliability packaging applications . 1364-1372.

cited authors

  • Kumbhat, N; Raj, PM; Pucha, RV; Atmur, S; Doraiswamy, R; Sundaram, V; Bhattacharya, S; Sitaraman, SK; Tummala, RR

authors

date/time interval

  • May 31, 2005 -

publication date

  • January 1, 2005

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Science & Technology
  • Technology

Location

  • FL, Lake Buena Vista

International Standard Book Number (ISBN) 10

Conference

  • 55th Electronic Components and Technology Conference

publisher

  • IEEE

start page

  • 1364

end page

  • 1372