Recent advances in composite substrate materials for high-density and high reliability packaging applications Conference

Kumbhat, N, Raj, PM, Pucha, RV et al. (2005). Recent advances in composite substrate materials for high-density and high reliability packaging applications . 2 1364-1372.

cited authors

  • Kumbhat, N; Raj, PM; Pucha, RV; Atmur, S; Doraiswamy, R; Sundaram, V; Bhattacharya, S; Sitaraman, SK; Tummala, RR

authors

abstract

  • This paper reports the evaluation of novel large-area Carbon-Silicon Carbide (C-SiC) based composite board material that has the advantages of organic boards in terms of large-area processability and machinability at potentially lowcost while retaining the high stiffness (>250GPa) and Si-matched CTE (∼2.5ppm/°C) of ceramics. In this work test vehicles were fabricated using C-SiC boards for assessing ultra-fine pitch solder joint reliability without underfill as well as the reliability of high-density wiring on the board. Finite element models were developed to simulate the thermomechanical behavior of test vehicles. From finite-element simulations as well as thermal-shock reliability tests, it was observed that high-stiffness low-CTE C-SiC boards do not show any premature solder-joint fatigue failure or dielectric cracking. Furthermore, the C-SiC boards show minimal via-pad misalignment supporting the multilayer build-up structure required to achieve very high wiring density. The modeling and experimental results suggest that the novel low-cost large-area ceramic matrix composite (C-SiC) has required thermomechanical properties, and is therefore a promising candidate substrate material for next-generation microsystems. © 2005 IEEE.

publication date

  • September 19, 2005

start page

  • 1364

end page

  • 1372

volume

  • 2