Thin film power components with nanoscale electrodes and conformal dielectrics Conference

Raj, PM, Sharma, H, Sethi, K et al. (2011). Thin film power components with nanoscale electrodes and conformal dielectrics . 106-110. 10.1109/NANO.2011.6144648

cited authors

  • Raj, PM; Sharma, H; Sethi, K; Wang, Y; Sundaram, V; Tummala, R

authors

abstract

  • Achieving high capacitance densities with capacitors integrated in thin film form has been a major challenge for the past few decades. Nanocapacitors utilizing nanostructured electrodes and conformal nanodielectrics provide unique opportunities to enhance capacitance volumetric efficiency by 5-10X compared to the state-of-the-art tantalum capacitors. This paper reports the first proof-of-concept demonstration of a novel silicon-compatible high-density capacitor technology. The key novelty stems from the tremendous enhancement in surface area from porous copper nanoelectrodes and conformal alumina dielectric on such nanoelectrodes. Alternative organic package compatible high-density capacitors using etched foils is also presented. Both approaches show substantial improvements in capacitance densities compared to traditional integrated thin film or trench capacitors. © 2011 IEEE.

publication date

  • December 1, 2011

Digital Object Identifier (DOI)

International Standard Book Number (ISBN) 13

start page

  • 106

end page

  • 110