Modeling, design and demonstration of ultra-miniaturized glass PA modules with efficient thermal dissipation
Conference
Kim, MS, Cho, S, Min, J et al. (2015). Modeling, design and demonstration of ultra-miniaturized glass PA modules with efficient thermal dissipation
. 2015-July 1163-1167. 10.1109/ECTC.2015.7159742
Kim, MS, Cho, S, Min, J et al. (2015). Modeling, design and demonstration of ultra-miniaturized glass PA modules with efficient thermal dissipation
. 2015-July 1163-1167. 10.1109/ECTC.2015.7159742
This paper addresses the thermal dissipation of power amplifier (PA) chips, which is one of the biggest challenges in the development of ultra-miniaturized glass-based RF modules. Glass packages with 3D or double-side active and passive integration offer the best miniaturization and performance enhancement for RF modules because glass has ultra-low loss, dimensional stability for precision thinfilm components, ability to process through-vias in large panels to reduce cost [1]. However, glass is a poor thermal conductor. Cooling of the high-power PA die with integrated miniaturized RF modules is, therefore, a key challenge. This paper provides extensive modeling studies of RF power amplifier modules with copper thermal vias in ultra-miniaturized glass, without additional process steps. It considers various power amplifier design options such as: a) Si vs. Silicon-on-Insulator (SOI), b) location of die hotspot, c) via geometry, and d) conformal vs. fully-filled vias, and provides optimal design recommendations with modeling and analysis.
