Ultra-thin, self-healing decoupling capacitors on thin glass interposers using high surface area electrodes Conference

Chakraborti, P, Sharma, H, Raj, PM et al. (2013). Ultra-thin, self-healing decoupling capacitors on thin glass interposers using high surface area electrodes . 1043-1047. 10.1109/ECTC.2013.6575701

cited authors

  • Chakraborti, P; Sharma, H; Raj, PM; Tummala, R

abstract

  • This paper presents a novel set of low-cost materials and processes to fabricate thinfilm decoupling capacitors on silicon and glass substrates, using printed valve-metal electrodes. The valve-metals such as Al and Ta allow for easy formation of conformal, robust and high insulation-strength dielectrics. By utilizing self-healing counter electrodes, high yield with low leakage currents were demonstrated. Such a thinfilm capacitor processing is compatible with large-area, high through-put glass substrates with through-vias. The process, therefore, allows double-side passive or active component integration in ultrathin substrates, leading to a unique and novel passive and active component integration technology referred to as 3D IPAC (3-Dimensional Integrated Actives and Passive components) for miniaturized and complete power or RF modules. © 2013 IEEE.

publication date

  • September 9, 2013

Digital Object Identifier (DOI)

International Standard Book Number (ISBN) 13

start page

  • 1043

end page

  • 1047