Processing, properties and electrical reliability of embedded ultra-thin film ceramic capacitors in organic packages Conference

Abothu, Isaac Robin, Raj, P Markondeya, Hwang, Jin Hyan et al. (2007). Processing, properties and electrical reliability of embedded ultra-thin film ceramic capacitors in organic packages . 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 1014-+. 10.1109/ECTC.2007.373921

International Collaboration

cited authors

  • Abothu, Isaac Robin; Raj, P Markondeya; Hwang, Jin Hyan; Kumar, Manish; Iyer, Mahadevan; Yamamoto, Hiroshi; Tummala, Rao

sustainable development goals

authors

date/time interval

  • January 1, 2007 -

publication date

  • January 1, 2007

published in

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Materials Science
  • Materials Science, Characterization & Testing
  • Materials Science, Multidisciplinary
  • Science & Technology
  • Technology

Location

  • NV, Reno

Digital Object Identifier (DOI)

International Standard Book Number (ISBN) 13

Conference

  • 57th Electronic Components and Technology Conference

publisher

  • IEEE

start page

  • 1014

end page

  • +