A New Era in Manufacturable, Low-Temperature and Ultra-Fine Pitch Cu Interconnections and Assembly Without Solders Conference

Smet, Vanessa, Kobayashi, Makoto, Wang, Tao et al. (2014). A New Era in Manufacturable, Low-Temperature and Ultra-Fine Pitch Cu Interconnections and Assembly Without Solders . 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 484-489.

International Collaboration

cited authors

  • Smet, Vanessa; Kobayashi, Makoto; Wang, Tao; Raj, Pulugurtha Markondeya; Tummala, Rao

authors

date/time interval

  • May 27, 2014 -

publication date

  • January 1, 2014

published in

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Science & Technology
  • Technology

Location

  • FL, Lake Buena Vista

Conference

  • IEEE 64th Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE

start page

  • 484

end page

  • 489