Ultrathin Antenna-Integrated Glass-Based Millimeter-Wave Package With Through-Glass Vias Article

Watanabe, Atom O, Lin, Tong-Hong, Ali, Muhammad et al. (2020). Ultrathin Antenna-Integrated Glass-Based Millimeter-Wave Package With Through-Glass Vias . IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 68(12), 5082-5092. 10.1109/TMTT.2020.3022357

cited authors

  • Watanabe, Atom O; Lin, Tong-Hong; Ali, Muhammad; Wang, Yiteng; Smet, Vanessa; Raj, Pulugurtha Markondeya; Tentzeris, Manos M; Tummala, Rao R; Swaminathan, Madhavan

authors

publication date

  • December 1, 2020

published in

keywords

  • ARRAY
  • Antenna-in-package (AiP)
  • Engineering
  • Engineering, Electrical & Electronic
  • SILICON
  • Science & Technology
  • Technology
  • fifth-generation (5G)
  • glass substrate
  • millimeter wave (mm-wave)
  • packaging

Digital Object Identifier (DOI)

publisher

  • IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

start page

  • 5082

end page

  • 5092

volume

  • 68

issue

  • 12