Integrated Copper Heat Slugs and EMI Shields in Panel Laminate (LFO) and Glass Fanout (GFO) Packages for High Power RF ICs Conference

Sundaram, Venky, Deprospo, Bartlet, Gezgin, Nahid et al. (2017). Integrated Copper Heat Slugs and EMI Shields in Panel Laminate (LFO) and Glass Fanout (GFO) Packages for High Power RF ICs . 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 300-305. 10.1109/ECTC.2017.339

cited authors

  • Sundaram, Venky; Deprospo, Bartlet; Gezgin, Nahid; Watanabe, Atomu; Raj, P Markondeya; Liu, Fuhan; Puckett, Waylon; Graham, Samuel; Tummala, Rao; Byers, Kyle; Garrison, Sean

authors

date/time interval

  • May 30, 2017 -

publication date

  • January 1, 2017

published in

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Science & Technology
  • Technology

Location

  • FL, Lake Buena Vista

Digital Object Identifier (DOI)

Conference

  • IEEE 67th Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE

start page

  • 300

end page

  • 305