Integrated Copper Heat Slugs and EMI Shields in Panel Laminate (LFO) and Glass Fanout (GFO) Packages for High Power RF ICs Conference

Sundaram, Venky, Deprospo, Bartlet, Gezgin, Nahid et al. (2017). Integrated Copper Heat Slugs and EMI Shields in Panel Laminate (LFO) and Glass Fanout (GFO) Packages for High Power RF ICs . 300-305. 10.1109/ECTC.2017.339

cited authors

  • Sundaram, Venky; Deprospo, Bartlet; Gezgin, Nahid; Watanabe, Atomu; Raj, P Markondeya; Liu, Fuhan; Puckett, Waylon; Graham, Samuel; Tummala, Rao; Byers, Kyle; Garrison, Sean

authors

date/time interval

  • May 30, 2017 -

publication date

  • January 1, 2017

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Science & Technology
  • Technology

Location

  • FL, Lake Buena Vista

Digital Object Identifier (DOI)

Conference

  • IEEE 67th Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE

start page

  • 300

end page

  • 305