3D Glass Package-Integrated, High-Performance Power Dividing Networks for 5G Broadband Antennas Conference

Ali, Muhammad, Watanabe, Atom, Lin, Tong-Hong et al. (2019). 3D Glass Package-Integrated, High-Performance Power Dividing Networks for 5G Broadband Antennas . 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 960-967. 10.1109/ECTC.2019.00150

cited authors

  • Ali, Muhammad; Watanabe, Atom; Lin, Tong-Hong; Pulugurtha, Markondeya R; Tentzeris, Manos M; Tummala, Rao R

authors

date/time interval

  • May 29, 2019 -

publication date

  • January 1, 2019

published in

keywords

  • 5G and mm-wave
  • Engineering
  • Engineering, Electrical & Electronic
  • IN-PACKAGE
  • RF
  • Science & Technology
  • T-junction
  • TECHNOLOGY
  • Technology
  • Yagi-Uda
  • antenna array
  • power divider
  • semi-additive process
  • small-cell

Location

  • NV, Las Vegas

Digital Object Identifier (DOI)

Conference

  • 69th IEEE Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE

start page

  • 960

end page

  • 967