Modeling, Design and Demonstration of Low-temperature, Low-pressure and High-throughput Thermocompression Bonding of Copper Interconnections without Solders Conference

Shahane, Ninad, McCann, Scott, Ramos, Gustavo et al. (2015). Modeling, Design and Demonstration of Low-temperature, Low-pressure and High-throughput Thermocompression Bonding of Copper Interconnections without Solders . 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 1859-1865.

International Collaboration

cited authors

  • Shahane, Ninad; McCann, Scott; Ramos, Gustavo; Killian, Arnd; Taylor, Robin; Sundaram, Venky; Raj, Pulugurtha Markondeya; Smet, Vanessa; Tummala, Rao

authors

date/time interval

  • May 26, 2015 -

publication date

  • January 1, 2015

published in

keywords

  • CHIP
  • CU
  • Computer Science
  • Computer Science, Theory & Methods
  • Engineering
  • Engineering, Electrical & Electronic
  • GOLD
  • RELIABILITY
  • Science & Technology
  • Technology

Location

  • CA, San Diego

Conference

  • IEEE 65th Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE

start page

  • 1859

end page

  • 1865