High Current-Carrying and Highly-Reliable 30μm Diameter Cu-Cu Area-Array Interconnections without Solder Conference

Khan, Sadia A, Kumbhat, Nitesh, Goyal, Abhishek et al. (2012). High Current-Carrying and Highly-Reliable 30μm Diameter Cu-Cu Area-Array Interconnections without Solder . 577-582.

Industry Collaboration International Collaboration

cited authors

  • Khan, Sadia A; Kumbhat, Nitesh; Goyal, Abhishek; Okoshi, Kodai; Raj, Pulugurtha; Meyer-Berg, Georg; Sundaram, Venky; Tummala, Rao

authors

date/time interval

  • May 29, 2012 -

publication date

  • January 1, 2012

keywords

  • Computer Science
  • Computer Science, Hardware & Architecture
  • Engineering
  • Engineering, Electrical & Electronic
  • Science & Technology
  • Technology

Location

  • CA, San Diego

Conference

  • 62nd IEEE Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE

start page

  • 577

end page

  • 582