High current-carrying and highly-reliable 30μm diameter Cu-Cu area-array interconnections without solder
Conference
Khan, SA, Kumbhat, N, Goyal, A et al. (2012). High current-carrying and highly-reliable 30μm diameter Cu-Cu area-array interconnections without solder
. 577-582. 10.1109/ECTC.2012.6248888
Khan, SA, Kumbhat, N, Goyal, A et al. (2012). High current-carrying and highly-reliable 30μm diameter Cu-Cu area-array interconnections without solder
. 577-582. 10.1109/ECTC.2012.6248888