Trend from ICs to 3D ICs to 3D Systems Conference

Tummala, Rao R, Sundaram, Venky, Chatterjee, Ritwik et al. (2009). Trend from ICs to 3D ICs to 3D Systems . 439-444. 10.1109/CICC.2009.5280817

cited authors

  • Tummala, Rao R; Sundaram, Venky; Chatterjee, Ritwik; Raj, P Markondeya; Kumbhat, Nitesh; Sukumaran, Vijay; Sridharan, Vivek; Choudury, Abhishek; Chen, Qiao; Bandyopadhyay, Tapobrata

authors

date/time interval

  • September 13, 2009 -

publication date

  • January 1, 2009

keywords

  • CHIP
  • Engineering
  • Engineering, Electrical & Electronic
  • INTERCONNECT
  • PERFORMANCE
  • PITCH
  • STACKING
  • Science & Technology
  • TECHNOLOGY
  • Technology

Location

  • CA, San Jose

Digital Object Identifier (DOI)

International Standard Book Number (ISBN) 13

Conference

  • IEEE Custom Integrated Circuits Conference

publisher

  • IEEE

start page

  • 439

end page

  • 444