Ultra fine-pitch wafer level packaging with reworkable composite nano-interconnects Conference

Aggarwal, AO, Raj, PM, Sacks, MD et al. (2004). Ultra fine-pitch wafer level packaging with reworkable composite nano-interconnects . 132-137. 10.1109/EPTC.2004.1396591

cited authors

  • Aggarwal, AO; Raj, PM; Sacks, MD; Tay, AAO; Tummala, RR

authors

date/time interval

  • December 8, 2004 -

publication date

  • January 1, 2004

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Engineering, Manufacturing
  • Materials Science
  • Materials Science, Characterization & Testing
  • Materials Science, Multidisciplinary
  • Optics
  • Physical Sciences
  • Science & Technology
  • Technology

Location

  • SINGAPORE, Singapore

Digital Object Identifier (DOI)

International Standard Book Number (ISBN) 10

Conference

  • 6th Electronics Packaging Technology Conference

publisher

  • IEEE

start page

  • 132

end page

  • 137