Aggarwal, AO, Raj, PM, Sacks, MD
et al. (2004). Ultra fine-pitch wafer level packaging with reworkable composite nano-interconnects
.
132-137.
Aggarwal, AO, Raj, PM, Sacks, MD et al. (2004). Ultra fine-pitch wafer level packaging with reworkable composite nano-interconnects
. 132-137.