Multifunctional integrated substrate technology for high density SOP packaging Conference

Liu, FH, Tummala, RR, Sundaram, V et al. (2004). Multifunctional integrated substrate technology for high density SOP packaging . 83-90. 10.1109/HPD.2004.1346678

cited authors

  • Liu, FH; Tummala, RR; Sundaram, V; Guidotti, D; Huang, ZR; Chang, YJ; Abothu, IR; Raj, PM; Bhattacharya, S; Balaraman, D; Chang, GK

authors

date/time interval

  • June 30, 2004 -

publication date

  • January 1, 2004

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Engineering, Manufacturing
  • Science & Technology
  • Technology

Location

  • PEOPLES R CHINA, Shanghai

Digital Object Identifier (DOI)

International Standard Book Number (ISBN) 10

Conference

  • 6th IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP 04)

publisher

  • IEEE

start page

  • 83

end page

  • 90