Accelerated Metastable Solid-liquid Interdiffusion Bonding with High Thermal Stability and Power Handling Article

Huang, Ting-Chia, Smet, Vanessa, Kawamoto, Satomi et al. (2018). Accelerated Metastable Solid-liquid Interdiffusion Bonding with High Thermal Stability and Power Handling . JOURNAL OF ELECTRONIC MATERIALS, 47(1), 368-377. 10.1007/s11664-017-5779-z

International Collaboration

cited authors

  • Huang, Ting-Chia; Smet, Vanessa; Kawamoto, Satomi; Pulugurtha, Markondeya R; Tummala, Rao R

authors

publication date

  • January 1, 2018

published in

keywords

  • AG-CU SOLDERS
  • DIFFUSION
  • Engineering
  • Engineering, Electrical & Electronic
  • GROWTH
  • INTERCONNECTION
  • INTERFACIAL REACTIONS
  • INTERMETALLIC COMPOUND
  • Intermetallics
  • KINETICS
  • Materials Science
  • Materials Science, Multidisciplinary
  • NI
  • NICKEL
  • PHOSPHORUS
  • Physical Sciences
  • Physics
  • Physics, Applied
  • Science & Technology
  • Technology
  • electromigration
  • interfacial reaction
  • solid liquid interdiffusion bonding

Digital Object Identifier (DOI)

publisher

  • SPRINGER

start page

  • 368

end page

  • 377

volume

  • 47

issue

  • 1