Design and Demonstration of Paper-Thin and Low-Warpage Single and 3D Organic Packages with Chip-Last Embedding Technology for Smart Mobile Applications Conference

Kim, Sung Jin, Wu, Zihan, Kobayashi, Makoto et al. (2014). Design and Demonstration of Paper-Thin and Low-Warpage Single and 3D Organic Packages with Chip-Last Embedding Technology for Smart Mobile Applications . 1384-1388.

International Collaboration

cited authors

  • Kim, Sung Jin; Wu, Zihan; Kobayashi, Makoto; Liu, Fuhan; Smet, Vanessa; Raj, P Markondeya; Sundaram, Venky; Tummala, Rao

authors

date/time interval

  • May 27, 2014 -

publication date

  • January 1, 2014

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Science & Technology
  • Technology

Location

  • FL, Lake Buena Vista

Conference

  • IEEE 64th Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE

start page

  • 1384

end page

  • 1388