Insulation reliability of fine-pitch through-vias in glass fiber reinforced halogen-free epoxy substrates Article

Ramachandran, Koushik, Ready, W Jud, Raj, P Markondeya et al. (2014). Insulation reliability of fine-pitch through-vias in glass fiber reinforced halogen-free epoxy substrates . JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 25(4), 1687-1695. 10.1007/s10854-014-1784-7

cited authors

  • Ramachandran, Koushik; Ready, W Jud; Raj, P Markondeya; Sundaram, Venky; Tummala, Rao

authors

publication date

  • April 1, 2014

published in

keywords

  • ANODIC FILAMENT FORMATION
  • Engineering
  • Engineering, Electrical & Electronic
  • Materials Science
  • Materials Science, Multidisciplinary
  • Physical Sciences
  • Physics
  • Physics, Applied
  • Physics, Condensed Matter
  • Science & Technology
  • Technology

Digital Object Identifier (DOI)

publisher

  • SPRINGER

start page

  • 1687

end page

  • 1695

volume

  • 25

issue

  • 4