Ramachandran, K, Ready, WJ, Raj, PM
et al. (2014). Insulation reliability of fine-pitch through-vias in glass fiber reinforced halogen-free epoxy substrates
.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 25(4), 1687-1695. 10.1007/s10854-014-1784-7
Ramachandran, K, Ready, WJ, Raj, PM et al. (2014). Insulation reliability of fine-pitch through-vias in glass fiber reinforced halogen-free epoxy substrates
. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 25(4), 1687-1695. 10.1007/s10854-014-1784-7